Thermal Conductivity of Filler and Un-filler Materials

Abstract

Promoting the heat flow from the heat source to heat sink, are one of the functions of potting materials in the electronic and motor world. The study of thermal conductivity of the potting material is one way to determine the heat flow of the potting material in electronics system and motor systems.The study of thermal conductivity properties will be conducted between filled and un-filled potting materials. Samples will also be studied with varying different thickness from bare coils to two inches diameter potting. Samples of potting materials will then be used to cast an energized magnet wire coil, the heat source. Multiple thermal couples will be embedded for data generation and collection. The specimen design is intended to be closer to a functional unit by incorporating a combination of components.The thermal conductivity properties result of the filled, un-filled and different thicknesses of the potting materials will be compared. With the studies of these properties, results should identify a potential screening solution of thermal protection for the products.