Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections

Romaric Kabre; David Danovitch; Valerie Oberson; Magali Cote

doi:10.1109/ectc51906.2022.00224

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JOURNAL ARTICLE

Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections

Romaric Kabre David Danovitch Valerie Oberson Magali Cote

Year: 2022 Journal: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pages: 1395-1402

DOI: 10.1109/ectc51906.2022.00224

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Abstract

International audience

Keywords:

Curing (chemistry) Materials science Flip chip Electrical conductor Composite material Adhesive Electrical resistivity and conductivity Optoelectronics Polymerization Radiation Thermal conductivity Thermal Wavelength Polymer Electrical engineering Optics

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Infrared Curing of Flip Chip Electrically Conductive Adhesive (ECA) Interconnections

Abstract

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