Properties and microstructure of copper/graphite composites with copper‐coated graphite fabricated by electroless plating and spark plasma sintering

Abstract

Abstract In order to improve the interfacial bonding between copper and graphite, copper was coated on the graphite by electroless plating. Copper/graphite composites with copper‐coated graphite were fabricated by spark plasma sintering. The effects of copper‐coated graphite on the density, electrical conductivity, mechanical properties, friction and wear properties of copper/graphite composites were studied. The results show that: copper plating on the graphite surface can improve the wettability of graphite and copper, and the interface between them is well bonded. Compared with pure copper, the microstructure of the composites was significantly refined after adding copper‐coated graphite. The mechanical properties of the composites were significantly improved, with yield compressive strength and elastic modulus increasing by 220 % and 240 %, respectively. With the increase of copper‐coated graphite contents, the density and the conductivity of the composites gradually decreased. The friction coefficient and wear rate of the composites were significantly reduced. The friction and wear mechanisms of the composites are mainly oxidation wear, fatigue wear and adhesive wear.