Structural, electronic, mechanical, and thermodynamic properties of Cu–Ti intermetallic compounds: First-principles calculations

Yang Xu; Meiling Tian; Changyi Hu; Zhaohui Han; Shenggang Zhou; Yong Cao

doi:10.1016/j.ssc.2022.114814

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Structural, electronic, mechanical, and thermodynamic properties of Cu–Ti intermetallic compounds: First-principles calculations

Yang Xu Meiling Tian Changyi Hu Zhaohui Han Shenggang Zhou Yong Cao

Year: 2022 Journal: Solid State Communications Vol: 352 Pages: 114814-114814 Publisher: Elsevier BV

DOI: 10.1016/j.ssc.2022.114814

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Keywords:

Intermetallic Debye model Enthalpy Thermodynamics Materials science Bulk modulus Density functional theory Chemical stability Physical chemistry Chemistry Computational chemistry Metallurgy Alloy

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MXene and MAX Phase Materials

Physical Sciences → Materials Science → Materials Chemistry

Intermetallics and Advanced Alloy Properties

Physical Sciences → Engineering → Mechanical Engineering

Boron and Carbon Nanomaterials Research

Physical Sciences → Materials Science → Materials Chemistry

Structural, electronic, mechanical, and thermodynamic properties of Cu–Ti intermetallic compounds: First-principles calculations

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