BOOK-CHAPTER
Fatigue Characterization of Lead-Free Solders
Year: 2012 Pages: 61-82
Keywords:
Lead (geology) Characterization (materials science) Materials science Nanotechnology Geology
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Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Metal Forming Simulation Techniques
Physical Sciences → Engineering → Mechanical Engineering
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