JOURNAL ARTICLE

Transient liquid phase diffusion bonding with imposed temperature gradient

Year: 2000 Journal:   Metal Powder Report Vol: 55 (11)Pages: 42-42   Publisher: Elsevier BV
Keywords:
Transient (computer programming) Materials science Temperature gradient Diffusion Liquid phase Phase (matter) Composite material Thermodynamics Chemistry Physics Organic chemistry Computer science Meteorology

Metrics

0
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.45
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Manufacturing Process and Optimization
Physical Sciences →  Engineering →  Industrial and Manufacturing Engineering

Related Documents

JOURNAL ARTICLE

Temperature-gradient transient liquid phase bonding under low pressure

Xuegang WangQian YanXingeng Li

Journal:   International Technology and Innovation Conference 2006 (ITIC 2006) Year: 2006 Vol: 2006 Pages: 32-34
JOURNAL ARTICLE

Transient liquid phase diffusion bonding under a temperature gradient: modelling of the interface morphology

H. Assadi

Journal:   Acta Materialia Year: 2001 Vol: 49 (1)Pages: 31-39
JOURNAL ARTICLE

Temperature gradient transient liquid phase diffusion bonding: a new method for joining advanced materials

A. A. ShirzadiE. R. Wallach

Journal:   Science and Technology of Welding & Joining Year: 1997 Vol: 2 (3)Pages: 89-94
© 2026 ScienceGate Book Chapters — All rights reserved.