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JOURNAL ARTICLE
Transient liquid phase diffusion bonding with imposed temperature gradient
Year:
2000
Journal:
Metal Powder Report
Vol:
55 (11)
Pages:
42-42
Publisher:
Elsevier BV
DOI:
10.1016/0026-0657(00)92222-7
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Keywords:
Transient (computer programming)
Materials science
Temperature gradient
Diffusion
Liquid phase
Phase (matter)
Composite material
Thermodynamics
Chemistry
Physics
Organic chemistry
Computer science
Meteorology
Metrics
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Cited By
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FWCI (Field Weighted Citation Impact)
0
Refs
0.45
Citation Normalized Percentile
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Is in top 10%
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Manufacturing Process and Optimization
Physical Sciences → Engineering → Industrial and Manufacturing Engineering
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