Surface topography simulation and roughness prediction of micro-milling single crystal copper

Abstract

To meet the requirements for assembly accuracy, service life and electric conductivity, the industry usually pursues low surface roughness of single-crystal copper micro-components. The processing and manufacturing of low-surface-roughness single crystal copper micro-components pose new challenges to the process. Micro-milling is an efficient technical way of processing small components with complex three-dimensional topography and low surface roughness. However, the surface forming mechanism of micro-milled single crystal copper is not clear. Based on the theory of trochoidal trajectory of micro-milling cutter, considering the influence of cutter geometry vibration, minimum cutting thickness and other factors. It analysed the formation mechanism of surface topography of single crystal copper micro-milling, and established a surface topography simulation model. The prediction of surface roughness was realised, and conducted a single crystal copper groove milling experiment to prove the effectiveness of the model and prediction.