JOURNAL ARTICLE
Testing and reliability of throughplatings in thin film hybrid circuits
Year: 1984 Journal: Microelectronics Journal Vol: 15 (3)Pages: 42-42 Publisher: Elsevier BV
Keywords:
Reliability (semiconductor) Electronic circuit Reliability engineering Materials science Electronic engineering Engineering Electrical engineering Physics
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Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
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