BOOK-CHAPTER
Evolution of the Microstructure in Electrochemically Deposited Copper Films at Room Temperature
Karen PantleonMarcel A.J. Somers
Year: 2007 Materials science forum Pages: 1261-1264 Publisher: Trans Tech Publications
Keywords:
Microstructure Copper Materials science Metallurgy Chemical engineering Engineering
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Topics
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
Electrodeposition and Electroless Coatings
Physical Sciences → Engineering → Electrical and Electronic Engineering
Anodic Oxide Films and Nanostructures
Physical Sciences → Materials Science → Materials Chemistry
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