Components and Printed Circuit Boards

Abstract

Since the invention of the integrated circuit (IC) in the latter part of the 1950s, the development of new integrated circuits of greater complexity as shown in Figure 1.1 (Chapter 1) has progressed very rapidly. Along with greater numbers of components per integrated circuit have come greater challenges in cooling of electronic equipment. Generally, heat is generated from metallized areas on a small, thin, and fragile silicon die or chip inside a package. The heat transfer engineer must address the issue of cooling of electronics at all levels of packaging.