JOURNAL ARTICLE
Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages
Romain CauchoisMohamed SaadaouiJacques LegeleuxThierry Malia
Year: 2012 Journal: Minerva Urology and Nephrology Vol: 75 (1)Pages: 92-98
Abstract
NA is a significant problem, difficult to assess, and can lead to dnDSA development also in our population. Identifying risk factors for NA might be an underestimated tool to improve graft and patient outcome in KTRs.
Keywords:
Electronics Interconnection Printed circuit board Chip Computer science Routing (electronic design automation) Nanotechnology Telecommunications Embedded system Engineering Electrical engineering Materials science
Metrics
3
Cited By
0.22
FWCI (Field Weighted Citation Impact)
11
Refs
0.55
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Nanomaterials and Printing Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Additive Manufacturing and 3D Printing Technologies
Physical Sciences → Engineering → Automotive Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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