Diatomite‐filled epoxy resin composites: Curing behavior, dielectric, and thermal properties

Abstract

Abstract In this study, a kind of novel curing agent composed of acrylic acid and 4,4′‐(hexafluoroisopropylidene)bis(p‐phenyleneoxy)dianiline was mixed, with different contents of diatomite (CP) particles, into the epoxy resin (E51) to obtain bio‐composites that can be rapidly molded and cured at room temperature. Fourier Transform Infrared Spectroscopy and Differential Scanning Calorimetry were used to study the curing behavior of epoxy resin and bio‐composites. The influence of CP particle dosages on the mechanical, including tensile, flexural and impact properties, and thermal properties of the prepared composites were discussed. Thermogravimetric analysis result showed that the thermal stability increased with increasing of CP fillers content. Dielectric property tests confirmed that the dielectric constant of composites decreased attributed to the incorporating of novel curing agent and CP fillers with porous structure into epoxy resin. Finally, Scanning Electron Microscope revealed the excellent adhesion between the cured resin and the fillers.