BOOK-CHAPTER

Production of Silver Coated Copper Powders by Electroless Plating Method

Abstract

Copper powders with very dense, uniform silver coating layer were prepared by electroless plating method in aqueous system at room temperature. Silver-copper composite powders were obtained by strictly controlling the activation and complexing process variables such as NH4OH/(NH4)2SO4 molar ratio, tartrate concentration, and feeding rate of silver ion solution. The mechanism of composite powders formation and their characteristics were discussed. It is noted that completely cleansing the oxide layers and protecting the copper particles surface from hydrolysis are key factors to obtain high quality Ag-Cu composite powders.

Keywords:
Copper Metallurgy Copper plating Materials science Electroless plating Plating (geology) Composite material Electroplating Layer (electronics) Geology

Metrics

0
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.27
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanoporous metals and alloys
Physical Sciences →  Materials Science →  Materials Chemistry
Nanomaterials and Printing Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

Related Documents

© 2026 ScienceGate Book Chapters — All rights reserved.