Properties of phenolic adhesives formulated with activated organosolv lignin derived from cornstalk

Shanghuan Feng; Tao Shui; Haoyu Wang; Xianbin Ai; Takashi Kuboki; Chunbao Xu

doi:10.1016/j.indcrop.2020.113225

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Properties of phenolic adhesives formulated with activated organosolv lignin derived from cornstalk

Shanghuan Feng Tao Shui Haoyu Wang Xianbin Ai Takashi Kuboki Chunbao Xu

Year: 2021 Journal: Industrial Crops and Products Vol: 161 Pages: 113225-113225 Publisher: Elsevier BV

DOI: 10.1016/j.indcrop.2020.113225

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Keywords:

Organosolv Lignin Adhesive Sodium hydroxide Formaldehyde Curing (chemistry) Phenol Chemistry Aqueous solution Materials science Composite material Nuclear chemistry Organic chemistry

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Topics

Lignin and Wood Chemistry

Physical Sciences → Engineering → Biomedical Engineering

Wood Treatment and Properties

Physical Sciences → Engineering → Building and Construction

Advanced Cellulose Research Studies

Physical Sciences → Materials Science → Biomaterials

Properties of phenolic adhesives formulated with activated organosolv lignin derived from cornstalk

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