JOURNAL ARTICLE

Properties of phenolic adhesives formulated with activated organosolv lignin derived from cornstalk

Shanghuan FengTao ShuiHaoyu WangXianbin AiTakashi KubokiChunbao Xu

Year: 2021 Journal:   Industrial Crops and Products Vol: 161 Pages: 113225-113225   Publisher: Elsevier BV
Keywords:
Organosolv Lignin Adhesive Sodium hydroxide Formaldehyde Curing (chemistry) Phenol Chemistry Aqueous solution Materials science Composite material Nuclear chemistry Organic chemistry

Metrics

34
Cited By
2.31
FWCI (Field Weighted Citation Impact)
45
Refs
0.86
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Lignin and Wood Chemistry
Physical Sciences →  Engineering →  Biomedical Engineering
Wood Treatment and Properties
Physical Sciences →  Engineering →  Building and Construction
Advanced Cellulose Research Studies
Physical Sciences →  Materials Science →  Biomaterials

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