Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion

Qi Luo; Hongting Pu; Zhihua Zhang; Xiong Zhang; Chenglong Yu

doi:10.1007/s10118-021-2524-0

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Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion

Qi Luo Hongting Pu Zhihua Zhang Xiong Zhang Chenglong Yu

Year: 2020 Journal: Chinese Journal of Polymer Science Vol: 39 (5)Pages: 566-572 Publisher: Springer Nature

DOI: 10.1007/s10118-021-2524-0

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Keywords:

Materials science Composite material Ultimate tensile strength Thermal conductivity Elongation Toughness Ethylene-vinyl acetate Conductivity Polyethylene Copolymer Polymer

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Polymer Foaming and Composites

Physical Sciences → Materials Science → Polymers and Plastics

Polymer Nanocomposites and Properties

Physical Sciences → Materials Science → Polymers and Plastics

Advanced Materials and Mechanics

Physical Sciences → Engineering → Mechanical Engineering

Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion

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Citation History

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