Mingxin LiKun YangWeiguang ZhuJunhua ShenJohn RollinsonMona M. HellaJie Lian
Expected to become mainstream in the electronics industry, flexible electronics still face major challenging issues. For polymeric-based flexible electronic substrates in particular, these challenges include a lack of electromagnetic shielding capability and poor heat dissipation. Here, we report a highly flexible and thermally conductive macroscopic polydimethylsiloxane (PDMS) polymer film embedded with a copper-coated reduced graphene oxide (rGO) fiber mesh. The rGO fibers are assembled into 3D fiber meshes and electroplated with micrometer-thick copper coatings, displaying excellent electrical and thermal conductivities. Oriented in the horizontal and perpendicular directions within the PDMS polymeric matrix, the fiber mesh serves as a highly electrically and thermally conductive backbone through the in-plane direction. Meanwhile, the fiber mesh also effectively shields electromagnetic interference in the X-band without causing thermal damage. The macroscopic film remains electrically insulated in the through-plane direction. Utilizing both the favorable thermal and electrical properties of the graphene fiber-based mesh and the flexibility of the PDMS matrix, our film may exhibit potential for flexible electronics applications such as wearable electronic thermal management and flexible microwave identification devices.
Mingxin Li (845172)Kun Yang (19445)Weiguang Zhu (238133)Junhua Shen (6541298)John Rollinson (8928443)Mona Hella (8928446)Jie Lian (634561)
Juan ChenJiaming WuHeyi GeDan ZhaoCong LiuXiufeng Hong
Filipa M. OliveiraJan LuxaDaniel BoušaZdeněk SoferRui Gusmão
Yangyang LinGenliang HouXunjia SuSong BiJin Tang
Van Viet TranNguyen Duc DungAn T. NguyenMario HofmannYa‐Ping HsiehHung‐Chih KanChia‐Chen Hsu