Statistical analysis on the mechanical and micro-structural characteristics of thermosonic Cu Al interconnection

JOURNAL ARTICLE

Year: 2020 Journal: Microelectronics Reliability Vol: 109 Pages: 113664-113664 Publisher: Elsevier BV

DOI: 10.1016/j.microrel.2020.113664

Keywords:

Interconnection Statistical analysis Materials science Computer science Telecommunications Mathematics Statistics

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