JOURNAL ARTICLE
Recent advances in polymer-based electronic packaging materials
Yan‐Jun WanGang LiYimin YaoXiaoliang ZengPengli ZhuRong Sun
Year: 2020 Journal: Composites Communications Vol: 19 Pages: 154-167 Publisher: Elsevier BV
Keywords:
Materials science Electronic packaging Flip chip Polymer Filler (materials) Electronic materials Electronics Thermal grease Nanotechnology Composite material Thermal conductivity Electrical engineering Engineering
Metrics
197
Cited By
6.69
FWCI (Field Weighted Citation Impact)
75
Refs
0.98
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electromagnetic wave absorption materials
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
Dielectric materials and actuators
Physical Sciences → Engineering → Biomedical Engineering
Polymer Nanocomposites and Properties
Physical Sciences → Materials Science → Polymers and Plastics
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