JOURNAL ARTICLE

Recent advances in polymer-based electronic packaging materials

Yan‐Jun WanGang LiYimin YaoXiaoliang ZengPengli ZhuRong Sun

Year: 2020 Journal:   Composites Communications Vol: 19 Pages: 154-167   Publisher: Elsevier BV
Keywords:
Materials science Electronic packaging Flip chip Polymer Filler (materials) Electronic materials Electronics Thermal grease Nanotechnology Composite material Thermal conductivity Electrical engineering Engineering

Metrics

197
Cited By
6.69
FWCI (Field Weighted Citation Impact)
75
Refs
0.98
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electromagnetic wave absorption materials
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Dielectric materials and actuators
Physical Sciences →  Engineering →  Biomedical Engineering
Polymer Nanocomposites and Properties
Physical Sciences →  Materials Science →  Polymers and Plastics

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