JOURNAL ARTICLE

Feasibility Study of Enhancing Microwave Brain Imaging Using Metamaterials

Eleonora RazzicchiaIoannis SotiriouHelena Cano-GarciaEfthymios KallosGeorge PalikarasPanagiotis Kosmas

Year: 2019 Journal:   Sensors Vol: 19 (24)Pages: 5472-5472   Publisher: Multidisciplinary Digital Publishing Institute

Abstract

We present an approach to enhance microwave brain imaging with an innovative metamaterial (MM) planar design based on a cross-shaped split-ring resonator (SRR-CS). The proposed metasurface is incorporated in different setups, and its interaction with EM waves is studied both experimentally and by using CST Microwave Studio® and is compared to a “no MM” case scenario. We show that the MM can enhance the penetration of the transmitted signals into the human head when placed in contact with skin tissue, acting as an impedance-matching layer. In addition, we show that the MM can improve the transceivers’ ability to detect useful “weak” signals when incorporated in a headband scanner for brain imaging by increasing the signal difference from a blood-like dielectric target introduced into the brain volume. Our results suggest that the proposed MM film can be a powerful hardware advance towards the development of scanners for brain haemorrhage detection and monitoring.

Keywords:
Microwave Microwave imaging Scanner Chipless RFID Human head Metamaterial Transceiver Materials science Planar Split-ring resonator Computer science Resonator Biomedical engineering Acoustics Optoelectronics Physics Engineering Telecommunications Artificial intelligence Absorption (acoustics)

Metrics

35
Cited By
2.05
FWCI (Field Weighted Citation Impact)
54
Refs
0.85
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Microwave Imaging and Scattering Analysis
Physical Sciences →  Engineering →  Biomedical Engineering
Wireless Body Area Networks
Physical Sciences →  Engineering →  Biomedical Engineering
Microwave and Dielectric Measurement Techniques
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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