Complex Structures in Microwave Circuits by Using Additive Manufacturing Techniques

Abstract

In this paper we present different microwave circuits working up to 10 GHz which have been implemented following a low cost 3D additive manufacturing process. It is shown how this technology can be used to propose disruptive circuit topologies and structures that cannot be implemented by conventional technologies (such as planar circuits on commercial laminates, waveguide or SIW technologies...) to attain suitable frequency responses. Three different circuits have been designed, simulated, fabricated and characterized: a lowpass stepped impedance filter, a diplexer satisfying the GSM and WLAN application frequencies, and a band-gap rectangular waveguide bandpass filter. Measured responses show a good performance and are in agreement with simulations.