Reliability Testing of Electrically Conductive Adhesive Joints for Surface Mount Printed-circuit-board

H. Tanaka

doi:10.11618/adhesion.43.187

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Reliability Testing of Electrically Conductive Adhesive Joints for Surface Mount Printed-circuit-board

H. Tanaka

Year: 2007 Journal: Journal of The Adhesion Society of Japan Vol: 43 (5)Pages: 187-194

DOI: 10.11618/adhesion.43.187

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Keywords:

Printed circuit board Mount Surface-mount technology Electrical conductor Adhesive Materials science Electrically conductive Reliability (semiconductor) Electrical engineering Optoelectronics Composite material Mechanical engineering Engineering Physics

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Material Properties and Processing

Physical Sciences → Engineering → Mechanics of Materials

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Reliability Testing of Electrically Conductive Adhesive Joints for Surface Mount Printed-circuit-board

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