Surface Morphology and Conductivity of Ag-Coated Cu Flakes Prepared by Electroless Ag Plating Using Different Additives

Ji Hwan Kim; Jong‐Hyun Lee

doi:10.1166/nnl.2018.2781

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JOURNAL ARTICLE

Surface Morphology and Conductivity of Ag-Coated Cu Flakes Prepared by Electroless Ag Plating Using Different Additives

Ji Hwan Kim Jong‐Hyun Lee

Year: 2018 Journal: Nanoscience and Nanotechnology Letters Vol: 10 (9)Pages: 1315-1320 Publisher: American Scientific Publishers

DOI: 10.1166/nnl.2018.2781

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Keywords:

Materials science Electroless plating Morphology (biology) Plating (geology) Conductivity Composite material Metallurgy Chemical engineering Surface (topology) Chemistry Layer (electronics) Electroplating Geometry Mathematics

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Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanoporous metals and alloys

Physical Sciences → Materials Science → Materials Chemistry

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Surface Morphology and Conductivity of Ag-Coated Cu Flakes Prepared by Electroless Ag Plating Using Different Additives

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