JOURNAL ARTICLE

Surface Morphology and Conductivity of Ag-Coated Cu Flakes Prepared by Electroless Ag Plating Using Different Additives

Ji Hwan KimJong‐Hyun Lee

Year: 2018 Journal:   Nanoscience and Nanotechnology Letters Vol: 10 (9)Pages: 1315-1320   Publisher: American Scientific Publishers
Keywords:
Materials science Electroless plating Morphology (biology) Plating (geology) Conductivity Composite material Metallurgy Chemical engineering Surface (topology) Chemistry Layer (electronics) Electroplating Geometry Mathematics

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Topics

Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanoporous metals and alloys
Physical Sciences →  Materials Science →  Materials Chemistry
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials

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