JOURNAL ARTICLE
EMC Modeling and Simulation in Quad Flat Package
Abstract
An investigation of electromagnetic compatibility (EMC) issue in a quad flat package (QFP) simulation model is presented in this paper. The S-parameter and electromagnetic radiation simulation are performed on two different configuration structures of a key transmission line. The Comparison results show that the ground-signal-ground (G-S-G) configuration structure increases the insertion loss coefficient S21 and reduces electromagnetic radiation at 7.43GHz relative to the ground-signal (G-S) configuration structure.
Keywords:
Electromagnetic compatibility Electromagnetic simulation Transmission line Electromagnetic environment Computer science Electronic engineering Radiation Acoustics Electrical engineering Physics Optics Engineering Telecommunications
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Topics
Electromagnetic Compatibility and Noise Suppression
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Material Properties and Processing
Physical Sciences → Engineering → Mechanics of Materials
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