UV-micromachining by excimer laser

Abstract

With the trend to ever smaller features the use of UV-wavelength for micromachining and micro-structuring applications in microelectronics-and semiconductor industry is steadily increasing. The use of excimer laser in combination with optimized UV-beam delivery systems presents the direct path to micromachining with highest resolution. Recent advances in excimer laser technology have greatly reduced the maintenance effort by extension of the gas lifetime and laser tube lifetime. With these new performance levels of advanced excimer laser and highly efficient UV-beam delivery systems, the excimer laser presents the cost effective solution for various applications in this industries. In this paper an update on excimer laser technology and on improved performance is given.