Embedding electronics in 3D printed structures by combining fused filament fabrication and supersonic cluster beam deposition

Andrea Bellacicca; Tommaso Santaniello; P. Milani

doi:10.1016/j.addma.2018.09.010

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JOURNAL ARTICLE

Embedding electronics in 3D printed structures by combining fused filament fabrication and supersonic cluster beam deposition

Andrea Bellacicca Tommaso Santaniello P. Milani

Year: 2018 Journal: Additive manufacturing Vol: 24 Pages: 60-66 Publisher: Elsevier BV

DOI: 10.1016/j.addma.2018.09.010

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Keywords:

Materials science Fabrication 3D printing Fused filament fabrication Electronic component Electrical conductor Optoelectronics Electronic circuit Electronics Printed electronics Nanotechnology Composite material Electrical engineering

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Additive Manufacturing and 3D Printing Technologies

Physical Sciences → Engineering → Automotive Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Embedding electronics in 3D printed structures by combining fused filament fabrication and supersonic cluster beam deposition

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