JOURNAL ARTICLE

MultiSoft

Sang Ho YoonLuis Merchán ParedesKe HuoKarthik Ramani

Year: 2018 Journal:   Proceedings of the ACM on Interactive Mobile Wearable and Ubiquitous Technologies Vol: 2 (3)Pages: 1-21   Publisher: Association for Computing Machinery

Abstract

We introduce MultiSoft, a multilayer soft sensor capable of sensing real-time contact localization, classification of deformation types, and estimation of deformation magnitudes. We propose a multimodal sensing pipeline that carries out both inverse problem solving and machine learning tasks. Specifically, we employ an electrical impedance tomography (EIT) for contact localization and a support vector machine (SVM) for classifying deformations and regressing their magnitudes. We propose a deformation-aware system which enables maintaining a persistent single-point contact localization throughout the deformation. By updating a time-varying distribution of conductivity change caused by deformations, a single-point contact localization can be maintained and restored to support interaction using both contact localization and deformations.We devise a multilayer structure to fabricate a highly stretchable and flexible soft sensor with a short sensor settlement after excitations. Through a series of experiments and evaluations, we validate both raw sensor and multimodal sensing performance with the proposed method. We further demonstrate applicability and feasibility of MultiSoft with example applications.

Keywords:
Deformation (meteorology) Computer science Pipeline (software) Support vector machine Artificial intelligence Point (geometry) Computer vision Materials science Mathematics Geometry

Metrics

18
Cited By
0.87
FWCI (Field Weighted Citation Impact)
48
Refs
0.69
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Tactile and Sensory Interactions
Life Sciences →  Neuroscience →  Cognitive Neuroscience
Advanced Sensor and Energy Harvesting Materials
Physical Sciences →  Engineering →  Biomedical Engineering
Electrical and Bioimpedance Tomography
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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