Joining of SiCf/SiC using a Ti3AlC2 filler and subsequent elimination of the joining layer

Pipit Fitriani; Dang‐Hyok Yoon

doi:10.1016/j.ceramint.2018.09.090

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Joining of SiCf/SiC using a Ti3AlC2 filler and subsequent elimination of the joining layer

Pipit Fitriani Dang‐Hyok Yoon

Year: 2018 Journal: Ceramics International Vol: 44 (18)Pages: 22943-22949 Publisher: Elsevier BV

DOI: 10.1016/j.ceramint.2018.09.090

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Keywords:

Materials science Composite material Filler (materials) Hot pressing Composite number Sintering Flexural strength Decomposition Microstructure Layer (electronics) Phase (matter) Electrophoretic deposition Coating

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MXene and MAX Phase Materials

Physical Sciences → Materials Science → Materials Chemistry

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Joining of SiCf/SiC using a Ti3AlC2 filler and subsequent elimination of the joining layer

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