Laser assisted fabrication of copper traces on dielectrics by electroless plating

Abstract

A new technology for circuit traces production: Selective Surface Activation Induced by Laser (SSAIL) enables to fabricate fine metallic structure on dielectric materials – polymers and glass. SSAIL contains three main steps: The first step is surface modification by laser, second – chemical activation of modified areas and the last step is metal deposition by electroless plating. A Picosecond laser was used for writing. The method has been investigated in detail for wide window of laser processing parameters. Sheet resistance measurement of finally plated sample and laser processed surface roughness measurement were carried out. This new technique can reduce production cost of circuit traces for molded interconnect devices.