3D printing of thermoplastic PI and interlayer bonding evaluation

Wenzheng Wu; Wenli Ye; Peng Geng; Yulei Wang; Guiwei Li; Xue Hu; Ji Zhao

doi:10.1016/j.matlet.2018.07.020

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JOURNAL ARTICLE

3D printing of thermoplastic PI and interlayer bonding evaluation

Wenzheng Wu Wenli Ye Peng Geng Yulei Wang Guiwei Li Xue Hu Ji Zhao

Year: 2018 Journal: Materials Letters Vol: 229 Pages: 206-209 Publisher: Elsevier BV

DOI: 10.1016/j.matlet.2018.07.020

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Keywords:

Materials science 3D printing Thermoplastic Polyimide Composite material Atmospheric temperature range Thermal stability Viscosity Layer (electronics) Chemical engineering

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Additive Manufacturing and 3D Printing Technologies

Physical Sciences → Engineering → Automotive Engineering

Injection Molding Process and Properties

Physical Sciences → Engineering → Mechanical Engineering

Manufacturing Process and Optimization

Physical Sciences → Engineering → Industrial and Manufacturing Engineering

3D printing of thermoplastic PI and interlayer bonding evaluation

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