Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity

Guodong Zhang; Lin Fan; Lan Bai; Minhui He; Lei Zhai; Mo Song

doi:10.1007/s10118-018-2155-2

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Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity

Guodong Zhang Lin Fan Lan Bai Minhui He Lei Zhai Mo Song

Year: 2018 Journal: Chinese Journal of Polymer Science Vol: 36 (12)Pages: 1394-1402 Publisher: Springer Nature

DOI: 10.1007/s10118-018-2155-2

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Keywords:

Polyimide Materials science Mesoscopic physics Thermal conductivity Composite material Percolation (cognitive psychology) Phase (matter) Conductivity Percolation threshold Electrical resistivity and conductivity Layer (electronics) Organic chemistry Physical chemistry Chemistry

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Synthesis and properties of polymers

Physical Sciences → Materials Science → Polymers and Plastics

Thermal properties of materials

Physical Sciences → Materials Science → Materials Chemistry

Polymer Nanocomposites and Properties

Physical Sciences → Materials Science → Polymers and Plastics

Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity

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