Investigation of aluminum patterned electrodeposition process from AlCl₃-[EMIm]Cl ionic liquid for microsystems application

Abstract

Aluminum electro-chemical-deposition (ECD) from ionic liquid has become an attracting deposition method. To extend the utilization of the film, in particular for microsystem applications, a microstructure formation by patterned ECD of Al from AlCl 3 -1-ethyl-3-methylimidazolium chloride ([EMIm]Cl) ionic liquid is investigated in this study. The influences of each deposition parameters to the ECD process as well as the resulting surface morphology are evaluated. It is also found that a recurrent galvanic pulse plating process yields in a higher current efficiency.