Hylke B. AkkermanRaghu K. PendyalaPradeep PandithaAhmed SalemJie ShenPeter van de WeijerPiet BoutenSuzanne de WinterKarin van Diesen‐TempelaarsGerard de HaasSoeren SteudelChing-Yu HuangMing‐Hsiang LaiYen-Yu HuangMing‐Hua YehAuke Jisk KronemeijerPaul PoodtGerwin H. Gelinck
We present a thin‐film dual‐layer bottom barrier on PI that is compatible with 350°C backplane processing for OLED displays. We demonstrate OLEDs that survive bending over 0.5 mm radius for 10.000x. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating AMOLED displays on GEN1‐sized substrates.
Hylke B. AkkermanRaghu K. PendyalaPradeep PandithaAhmed SalemJie ShenPeter van de WeijerPiet BoutenSuzanne H.P.M. de WinterKarin van Diesen‐TempelaarsGerard de HaasSoeren SteudelChing‐Yu HuangMing‐Hsiang LaiYen‐Yu HuangMing‐Hua YehAuke Jisk KronemeijerPaul PoodtGerwin H. Gelinck
Chia‐Hsun TuChia‐Chun ChangJifeng ChenMing‐Chang HsuWei‐Jung HsiehWenting WangCheng-Hao ChangYen‐Huei LaiWan‐Tsang WangChe‐Ming HsuHong‐Shen LinKeh‐Long HwuYu‐Hsin Lin
Keunwoo KimBummo SungDoona KimSangsub KimHanbit KimJiyeong ShinHyena KwakDokyeong LeeChanyoub SeolSanggun ChoiJun Hyung LimTaewook KangChanghee Lee
Glory ChenShu‐Tang YehJia-Chong HoCheng-Chung LeeChen-Kuan KuoHao-Fei KuoYu-Hsun WuWen-Hsin YangChih‐Wei LinKuo‐Hsuan YuChih-Haw Wang