3D surface mount component modeling for HFSS

Abstract

Advances in full-wave three-dimensional electromagnetic simulation and modeling of surface mount components are demonstrated for example coupled multi-layer capacitor and wire wound inductor configurations. Among the advances enabling 3 ^rd party model sharing is the ability to encrypt the proprietary material and geometry properties in ANSYS® HFSS™ that are used to define the models. In this work, 3D EM models are shown to be accurate for coupled shunt capacitor and inductor test cases where individual circuit models fail to predict the shift in complex resonance frequency behavior.