Modified inductively coupled plasma reactive ion etch process for high aspect ratio etching of fused silica, borosilicate and aluminosilicate glass substrates

Chenchen Zhang; Srinivas Tadigadapa

doi:10.1016/j.sna.2018.02.020

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Modified inductively coupled plasma reactive ion etch process for high aspect ratio etching of fused silica, borosilicate and aluminosilicate glass substrates

Chenchen Zhang Srinivas Tadigadapa

Year: 2018 Journal: Sensors and Actuators A Physical Vol: 273 Pages: 147-158 Publisher: Elsevier BV

DOI: 10.1016/j.sna.2018.02.020

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Keywords:

Borosilicate glass Aluminosilicate Reactive-ion etching Inductively coupled plasma Etching (microfabrication) Materials science Analytical Chemistry (journal) Polishing Fluorine Mineralogy Chemical engineering Chemistry Composite material Plasma Metallurgy Layer (electronics) Chromatography Organic chemistry

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Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Silicon Nanostructures and Photoluminescence

Physical Sciences → Materials Science → Materials Chemistry

Ga2O3 and related materials

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Modified inductively coupled plasma reactive ion etch process for high aspect ratio etching of fused silica, borosilicate and aluminosilicate glass substrates

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