Formation of high aspect ratio fused silica nanowalls by fluorine-based deep reactive ion etching

Jung-Rae Park; Aaron Berndt; Young Keun Kim; Ji Sung Lee; Jong Eun Ryu; Daniel Choï

doi:10.1016/j.nanoso.2017.10.004

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Formation of high aspect ratio fused silica nanowalls by fluorine-based deep reactive ion etching

Jung-Rae Park Aaron Berndt Young Keun Kim Ji Sung Lee Jong Eun Ryu Daniel Choï

Year: 2017 Journal: Nano-Structures & Nano-Objects Vol: 15 Pages: 212-215 Publisher: Elsevier BV

DOI: 10.1016/j.nanoso.2017.10.004

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Keywords:

Deep reactive-ion etching Materials science Nanoimprint lithography Fabrication Reactive-ion etching Etching (microfabrication) Mold Resist Layer (electronics) Aspect ratio (aeronautics) Lithography Optoelectronics Nanotechnology Composite material

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Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Nanowire Synthesis and Applications

Physical Sciences → Engineering → Biomedical Engineering

Advancements in Photolithography Techniques

Physical Sciences → Engineering → Electrical and Electronic Engineering

Formation of high aspect ratio fused silica nanowalls by fluorine-based deep reactive ion etching

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