Polyurethane-based flexible conductive adhesives

Abstract

Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. Here, flexible conductive adhesives were fabricated with Ag microflakes (AgMFs), Ag nanodendri tes (AgNDs) and thermoplastic polyurethane (TPU). The AgNDs were prepared by a facile replacement reaction between silver nitrate and zinc microparticles. The products were characterized by scanning electron microscopy (SEM) and X-ray powder diffraction (XRD). The conducti ve stability of the flexible conductive adhesives was studied in the bending condition. The electrical resistance was increased from 0.0267 Ω to 0.0542 Ω (R/R ₀ = 2.03) after 200 cycles of bending. The conductive adhesives with high conductive stability may be useful for flexible circuits and wearable electronics applications.