JOURNAL ARTICLE

OS0729 Growth behaviour of a small crack in ultrafine grained copper processed by ECAP

Yukio AndoMasahiro GotoSeung-Zeon HanNorihito TESHIMANorio KAWAGOISHI

Year: 2009 Journal:   The Proceedings of the Materials and Mechanics Conference Vol: 2009 (0)Pages: 528-529   Publisher: Japan Society Mechanical Engineers

Abstract

High-cycle fatigue tests were carried out on smooth specimens of ultrafine-grained copper produced by equal channel angular pressing(ECAP). Grain sizes of 300nm were formed after twelve passages of ECAP pressing by Be route. Fatigue tests were conducted using a rotating bending fatigue machine. A major crack, which led to the final fracture of the specimen, initiated from shear bands. After initiation, Hie growth rate increased with an increase in crack length. However, a decrease in growth rate with a change in growth path morphology occurred when the crack length 0.10.3mm, respectively. This decrease occurred because of a change in the crack growth mechanism and is explained by considering the interrelation between grain size and the reversible plastic zone size at the crack tip.

Keywords:
Materials science Pressing Copper Grain size Metallurgy Shear (geology) Fracture (geology) Bending Growth rate Paris' law Composite material Grain growth Crack closure Fracture mechanics Geometry

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Topics

Metal Forming Simulation Techniques
Physical Sciences →  Engineering →  Mechanical Engineering
Metallurgy and Material Forming
Physical Sciences →  Engineering →  Mechanics of Materials
Microstructure and mechanical properties
Physical Sciences →  Materials Science →  Materials Chemistry

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