JOURNAL ARTICLE

Broadband Planar Transition to Dielectric Image Line by Substrate Truncated Microstrip Line for Millimeter-Wave Circuit Integration

Chandra Shekhar PrasadAnimesh Biswas

Year: 2017 Journal:   IEEE Microwave and Wireless Components Letters Vol: 27 (6)Pages: 533-535   Publisher: IEEE Microwave Theory and Techniques Society

Abstract

In this letter, a broadband planar substrate truncated tapered microstrip line-to-dielectric image line transition on a single substrate is proposed. The design uses substrate truncated microstrip line which helps to minimize the losses due to the surface wave generation on thick microstrip line. Generalized empirical equations are proposed for the transition design and validated for different dielectric constants in millimeter-wave frequency band. Full-wave simulations are carried out using high frequency structural simulator. A back-to-back transition prototype of Ku-band is fabricated and measured. The measured return loss for 80-mm-long structure is better than 10 dB and the insertion loss is better than 2.5 dB in entire Ku-band (40% impedance bandwidth).

Keywords:
Microstrip Extremely high frequency Return loss Broadband Materials science Planar Insertion loss Bandwidth (computing) Optics Optoelectronics Dielectric Microstrip antenna Electrical impedance Telecommunications Electrical engineering Physics Engineering Computer science Antenna (radio)

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11
Cited By
0.53
FWCI (Field Weighted Citation Impact)
10
Refs
0.69
Citation Normalized Percentile
Is in top 1%
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Citation History

Topics

Microwave Engineering and Waveguides
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electromagnetic Compatibility and Noise Suppression
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced Antenna and Metasurface Technologies
Physical Sciences →  Engineering →  Aerospace Engineering

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