Sungjun KimYao‐Feng ChangMin‐Hwi KimTae-Hyeon KimYoon KimByung‐Gook Park
Here, we present evidence of self-compliant and self-rectifying bipolar resistive switching behavior in Ni/SiNx/n+ Si and Ni/SiNx/n++ Si resistive-switching random access memory devices. The Ni/SiNx/n++ Si device’s Si bottom electrode had a higher dopant concentration (As ion > 1019 cm−3) than the Ni/SiNx/n+ Si device; both unipolar and bipolar resistive switching behaviors were observed for the higher dopant concentration device owing to a large current overshoot. Conversely, for the device with the lower dopant concentration (As ion < 1018 cm−3), self-rectification and self-compliance were achieved owing to the series resistance of the Si bottom electrode.
Hee‐Dong KimHo-Myoung AnYun Mo SungHyunsik ImTae Geun Kim
Sungyeon RyuSeong Keun KimByung Joon Choi
F. NardiSimone BalattiStefano LarentisD. C. GilmerDaniele Ielmini
Hsueh-Chih TsengTing‐Chang ChangKai-Hung ChengJheng-Jie HuangYuting ChenFu-Yen JianSimon M. SzeMing‐Jinn TsaiAnn‐Kuo ChuYing-Lang Wang
Chen‐Fang KangShih‐Min HuangYen‐Hsuan ChenJianshi TangPo‐Kang Yang