JOURNAL ARTICLE
Effect of Void on Fatigue Life of Lead-Free Solder Joints
Ken KAMINISHIYukihiro KawamuraMotoharu TanedaHirohide Kaida
Year: 2002 Journal: The Proceedings of Conference of Chugoku-Shikoku Branch Vol: 2002 (0)Pages: 9-10 Publisher: Japan Society Mechanical Engineers
Keywords:
Soldering Void (composites) Lead (geology) Materials science The Void Forensic engineering Metallurgy Composite material Engineering Geology Philosophy
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Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Engineering and Materials Science Studies
Physical Sciences → Engineering → Mechanical Engineering
Powder Metallurgy Techniques and Materials
Physical Sciences → Engineering → Mechanical Engineering
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