JOURNAL ARTICLE

Corrosion Resistance Of Electroless Ni-P/Cu/Ni-P Multilayer Coatings

Guosheng ZhaoYan ZouYongmei HaoZhifeng Zou

Year: 2015 Journal:   Archives of Metallurgy and Materials Vol: 60 (2)Pages: 1003-1008   Publisher: De Gruyter Open

Abstract

Abstract Ni-P/Cu/Ni-P multilayer coatings were prepared by deposition of Cu layer between two Ni–P layers. The Cu layer was deposited by metal displacement reaction between Cu 2+ and Fe atoms. Corrosion behavior of single-layer Ni-P coatings, double-layer Ni-P/Cu coatings, and three-layer Ni-P/Cu/Ni-P coatings were investigated by electrochemical tests in 3.5% NaCl solution. The three-layer coatings exhibited more positive E corr and decreased I corr compared with conventional single-layer Ni-P coatings, which indicated an improved corrosion resistance. The polarization curves of the three-layer coatings were characterized by two passive regions. The improved corrosion resistance was not only attributed to the function of the blocked pores of Cu. The Cu interlayer also acted as a sacrificial layer instead of a barrier in the coatings, which altered the corrosion mechanism and further improved the corrosion resistance of the coatings.

Keywords:
Corrosion Materials science Layer (electronics) Polarization (electrochemistry) Metallurgy Metal Copper Conversion coating Electrochemistry Barrier layer Deposition (geology) Chemical engineering Composite material Chemistry Electrode

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Citation History

Topics

Electrodeposition and Electroless Coatings
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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