Network Patterning: Maskless Fabrication of Highly Robust, Flexible Transparent Cu Conductor by Random Crack Network Assisted Cu Nanoparticle Patterning and Laser Sintering (Adv. Electron. Mater. 12/2016)
Young Duk SuhJinhyeong KwonJinhwan LeeHabeom LeeSung‐Min JungDongkwan KimHyunmin ChoJunyeob YeoSeung Hwan Ko
Abstract
A highly flexible Cu random-network transparent conductor has been developed by Y. D. Suh et al. This conductor is fabricated through random nano-crack generation and subsequent Cu nanoparticle ink filling/transfer, and oxidation-free laser sintering, as described in article number 1600277. This technique, applied as a transfer-printing template, enables large-area, high-resolution network patterning and fabrication in a simple massless manner.
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