Calculation of thermal conductivity of filled oligomeric compositions

Abstract

Different models for the calculation of thermal conductivity of oligomeric compositions filled with a dispersed filler (silicon carbide) are studied. It is shown that the calculated values of thermal conductivity of oligomeric compositions with introduced dispersed filler provided by the van Krevelen model developed for the calculation of thermal conductivity of unfilled amorphous polymers with isolated regions of the crystalline phase are the closest to the experimental ones.