Buried Vias in Multilayer Printed Wiring Boards

BOOK-CHAPTER

Year: 1996 Pages: 301-305

DOI: 10.1007/978-94-009-0323-4_31

Keywords:

Printed circuit board Materials science 3d printed Optoelectronics Electrical engineering Engineering Biomedical engineering

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Electrical Contact Performance and Analysis

Physical Sciences → Engineering → Mechanical Engineering

Recycling and Waste Management Techniques

Physical Sciences → Environmental Science → Industrial and Manufacturing Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering