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BOOK-CHAPTER
Layer-by-layer assembly
Hua Feng
Yuri Lvov
Year:
2008
Elsevier eBooks
Pages:
1-44
Publisher:
Elsevier BV
DOI:
10.1016/b978-008045052-0.50003-8
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Keywords:
Layer (electronics)
Materials science
Composite material
Metrics
21
Cited By
8.48
FWCI (Field Weighted Citation Impact)
105
Refs
0.97
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Polymer Surface Interaction Studies
Physical Sciences → Materials Science → Surfaces, Coatings and Films
Molecular Junctions and Nanostructures
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced biosensing and bioanalysis techniques
Life Sciences → Biochemistry, Genetics and Molecular Biology → Molecular Biology
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