Preparation of Composite Particles via Electroless Nickel Plating on Polystyrene Microspheres and Effect of Plating Conditions

Byung Chul Kim; Jin‐Hong Park; Seong Jae Lee

doi:10.7317/pk.2010.34.1.25

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JOURNAL ARTICLE

Preparation of Composite Particles via Electroless Nickel Plating on Polystyrene Microspheres and Effect of Plating Conditions

Byung Chul Kim Jin‐Hong Park Seong Jae Lee

Year: 2010 Journal: Polymer Korea Vol: 34 (1)Pages: 25-31 Publisher: The Polymer Society of Korea

DOI: 10.7317/pk.2010.34.1.25

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Abstract

초록 · 키워드 목차 오류제보하기 등록된 정보가 없습니다. #electroless nickel plating #Monodisperse polystyrene particle #pre-treatment condition 등록된 정보가 없습니다.

Keywords:

Plating (geology) Composite number Microsphere Electroless plating Materials science Nickel Polystyrene Electroless nickel plating Expanded polystyrene Composite material Chemical engineering Metallurgy Electroplating Polymer Engineering

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Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Preparation of Composite Particles via Electroless Nickel Plating on Polystyrene Microspheres and Effect of Plating Conditions

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