Crack Propagation Behaviour of Four Types of Lead and Lead-Free Solders in Push-Pull Low Cycle Fatigue.

Abstract

This paper studies the crack propagation behavior of four types of lead and lead-free solders. Crack propagation tests were carried out using center cracked specimens of Sn-37 Pb, Sn-3.5 Ag-iCu, Sn-5 Sb, and Sn-7.5 Bi-2 Ag-0.5 Cu under push-pull straining at 313 K. Crack propagation rates of the solders were successfully correlated with cyclic J-integral range. The material dependency of crack propagation rate was discussed in relation with the observations of fracture surface and tensile property of the solders. Ductility of materials was suggested to have a significant influence on crack propagation rate but melting temperature has a small influence on the propagation rate.