Microchannel Heat Sink Based on Boiling Heat Transfer.

Abstract

Development of a heat sink for future integrated circuit chips has been achieved on the basis of boiling heat transfer in a vertical microchannel. The microchannel was manufactured on a 1.5 mm-thick copper plate by electric discharge machining. The performance of the three kinds of micro-channel heat sinks of which cross sections were 2, 4, and 16 mm wide and 0.5 mm high was determined by using distilled water as the working fluid. The effect of multichannels on the performance for heat sink shown experimentally. As a result, the maximum heat flux was found to be 300 W/cm2 for the four-channels heat sink. Hydrodynamic instability on the vapor-liquid interface in a channel was considered for the theoretical evaluation of critical heat flux of the microchannel. Flow instability in a closed circulation loop of the heat sink was also analyzed.