JOURNAL ARTICLE

Modeling of Aspect Ratio Dependent Etching in an Inductively Coupled Plasma

J. S. HANJ.P. McVittie

Year: 1995 Journal:   MRS Proceedings Vol: 389   Publisher: Cambridge University Press
Keywords:
Materials science Deep reactive-ion etching Inductively coupled plasma Etching (microfabrication) Sputtering Trench Deposition (geology) Sticking probability Plasma Reactive-ion etching Analytical Chemistry (journal) Adsorption Composite material Nanotechnology Thin film Chemistry Desorption Layer (electronics) Chromatography

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Topics

Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Plasma Diagnostics and Applications
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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