JOURNAL ARTICLE

Evaporation Kinetics of Sessile Water Droplets on Micropillared Superhydrophobic Surfaces

Wei XuRajesh LeeladharYong Tae KangChang‐Hwan Choi

Year: 2013 Journal:   Langmuir Vol: 29 (20)Pages: 6032-6041   Publisher: American Chemical Society

Abstract

Evaporation modes and kinetics of sessile droplets of water on micropillared superhydrophobic surfaces are experimentally investigated. The results show that a constant contact radius (CCR) mode and a constant contact angle (CCA) mode are two dominating evaporation modes during droplet evaporation on the superhydrophobic surfaces. With the decrease in the solid fraction of the superhydrophobic surfaces, the duration of a CCR mode is reduced and that of a CCA mode is increased. Compared to Rowan's kinetic model, which is based on the vapor diffusion across the droplet boundary, the change in a contact angle in a CCR (pinned) mode shows a remarkable deviation, decreasing at a slower rate on the superhydrophobic surfaces with less-solid fractions. In a CCA (receding) mode, the change in a contact radius agrees well with the theoretical expectation, and the receding speed is slower on the superhydrophobic surfaces with lower solid fractions. The discrepancy between experimental results and Rowan's model is attributed to the initial large contact angle of a droplet on superhydrophobic surfaces. The droplet geometry with a large contact angle results in a narrow wedge region of air along the contact boundary, where the liquid-vapor diffusion is significantly restricted. Such an effect becomes minor as the evaporation proceeds with the decrease in a contact angle. In both the CCR and CCA modes, the evaporative mass transfer shows the linear relationship between mass(2/3) and evaporation time. However, the evaporation rate is slower on the superhydrophobic surfaces, which is more significant on the surfaces with lower solid fractions. As a result, the superhydrophobic surfaces slow down the drying process of a sessile droplet on them.

Keywords:
Contact angle Evaporation RADIUS Diffusion Materials science Kinetics Chemistry Kinetic energy Thermodynamics Composite material Physics Classical mechanics

Metrics

140
Cited By
8.68
FWCI (Field Weighted Citation Impact)
60
Refs
0.99
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Nanomaterials and Printing Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Surface Modification and Superhydrophobicity
Physical Sciences →  Materials Science →  Surfaces, Coatings and Films
Fluid Dynamics and Thin Films
Physical Sciences →  Engineering →  Computational Mechanics

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